Aluminum Wire Bonding

Aluminum Wire Bonding uses aluminum wire (typically 25-50μm diameter) for interconnecting die to package leads, favored for power devices and specific reliability requirements.

## What Is Aluminum Wire Bonding?

• Material: 99.99% pure aluminum or Al-1%Si alloy
• Process: Ultrasonic (US) wedge bonding at room temperature
• Bond Type: Wedge-wedge (no ball formation)
• Applications: Power modules, automotive, thick wire (>100μm)

## Why Aluminum Wire Bonding Matters

Unlike gold or copper, aluminum can be bonded at room temperature using pure ultrasonic energy—critical for temperature-sensitive devices and thick wire applications.

Aluminum vs. Gold/Copper Wire:
| Property | Aluminum | Gold | Copper |
|----------|----------|------|--------|
| Bond temp | Room temp | 150-200°C | 150-200°C |
| Bond type | Wedge | Ball-stitch | Ball-stitch |
| Thick wire | Yes (>100μm) | Difficult | Difficult |
| Corrosion | Passivates | None | Requires protection |