Bevel Edge

Bevel Edge refers to the angled profile machined into wafer edges during manufacturing, typically at 15-22° angles to reduce chipping and improve handling.

## What Is a Bevel Edge?

  • Geometry: Angled cut from wafer face to edge, 15-22° typical
  • Standard: SEMI M1 specifies edge profile parameters
  • Purpose: Reduce stress concentrations, ease film coating
  • Types: Single bevel, double bevel, rounded bevel

## Why Bevel Edge Profile Matters

Proper bevel geometry affects epitaxial growth uniformity, photoresist edge coating, and mechanical handling robustness throughout processing.

Bevel Edge Geometries:Single Bevel: Double Bevel: ┌────── ╱────────╲ │ ╱ ╲ │ 22° │ │ ╱ │ wafer │ ╱ ╲ ╱ ╱ ╲────────╱ Symmetric profile

SEMI M1 Edge Parameters:
| Parameter | 200mm | 300mm |
|-----------|-------|-------|
| Bevel angle | 18-22° | 18-22° |
| Edge exclusion | 3mm | 2mm |
| Edge lip | <0.5μm | <0.5μm |
| Edge chips | None visible | None visible |

300mm wafers use tighter edge specifications due to higher processing costs per wafer.

Take bevel edge further

Ask the copilot about this term, or have our engineers assess it against your process.

Ask CFSGPT about this → Request a technical assessment → Open the CFS app