Gold Wire Bonding is a semiconductor interconnect technique using thin gold wire (15-50μm diameter) to connect die bond pads to package lead frames or substrates.
## What Is Gold Wire Bonding?
Material: 99.99% pure gold (4N) or gold alloys
Process: Thermosonic bonding at 150-220°C
Bond Types: Ball bond (1st bond) and stitch bond (2nd bond)
Speed: 15-25 wires per second on modern equipment
## Why Gold Wire Bonding Matters
Gold has been the industry standard for decades due to excellent conductivity, corrosion resistance, and reliable ball formation.
Gold vs. Copper Wire: | Property | Gold | Copper | |----------|------|--------| | Cost | High ($60/oz) | Low ($0.30/oz) | | Conductivity | Good | Better | | Corrosion | Excellent | Needs protection | | Bond force | Lower | Higher |
Gold remains preferred for high-reliability automotive and aerospace applications.
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