Return Material Analysis

RMA (Return Material Analysis) is the systematic failure analysis of customer-returned semiconductor devices — performing electrical characterization, physical analysis (decapsulation, SEM, FIB, TEM), and root cause identification to determine why the device failed in the field.

RMA Process

• Electrical Test: Reproduce the customer's reported failure — characterize the failure mode (short, open, parametric drift).
• Fault Localization: Use emission microscopy (EMMI), OBIRCH, thermal imaging, or laser probing to locate the failure site.
• Physical Analysis: Decapsulate, delayer, cross-section — SEM/TEM imaging of the failure site.
• Root Cause: Determine if the failure is due to fab defect, design weakness, test escape, or customer misuse.

Why It Matters

• Actionable: RMA results drive specific corrective actions — process changes, test coverage improvements, design fixes.
• Turnaround: Fast RMA turnaround (<2-4 weeks) is critical for maintaining customer trust.
• Database: RMA results build a knowledge base of failure modes — enabling predictive quality improvement.

RMA is the postmortem for failed chips — systematic failure analysis of customer returns to identify root causes and prevent recurrence.