Vacuum Packaging

Vacuum packaging is the package sealing process that encloses devices under reduced pressure to control damping, contamination, and long-term stability - it is critical for many resonant and inertial MEMS devices.

What Is Vacuum packaging?

• Definition: Creation of low-pressure cavity during wafer or die-level package sealing.
• Process Elements: Includes cavity evacuation, sealing, and leak-rate qualification.
• Performance Coupling: Internal pressure directly affects quality factor and dynamic response.
• Supporting Features: Often combined with getters and hermetic bond structures.

Why Vacuum packaging Matters

• Sensor Performance: Vacuum conditions improve resonance behavior and signal fidelity.
• Noise Reduction: Lower gas damping can increase sensitivity in certain device classes.
• Reliability: Controlled atmosphere protects structures from oxidation and contamination.
• Calibration Stability: Pressure consistency reduces device-to-device variation and drift.
• Application Readiness: Automotive and industrial sensors often require stable vacuum cavities.

How It Is Used in Practice

• Seal Process Control: Tune bonding parameters to capture target pressure at closure.
• Leak Screening: Use helium and pressure-decay tests to verify cavity retention.
• Long-Term Validation: Run aging tests to confirm vacuum stability across mission profile.

Vacuum packaging is a performance-defining package approach for sensitive MEMS devices - vacuum integrity is essential for predictable long-term sensor behavior.