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Glossary

3,538 technical terms and definitions

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Pitch Scaling in Advanced Packaging

advanced packaging

Pitch Scaling in Advanced Packaging is the progressive reduction of interconnect pitch (center-to-center distance between adjacent connections) between stacked dies or between die…

Planar Process 1959 Oxide Already Covered Junction

hoerni 1959 lateral diffusion insight surface junction, planar transistor 1959 junction under oxide recognition, silicon planar 1959 realization not new fabrication technique

Recognize That the Masking Oxide Already Covered the Junction the Whole Time: The Insight, Not the Material 1. Why the Lateral Diffusion Everyone Already Knew About Was the Whole…

Planar Process 1959 Open Contact Windows Photolithography

hoerni 1959 contact window margin lateral diffusion design, planar transistor 1959 window inside diffused region oxide intact, silicon planar 1959 reuses photolithography new purpose

Open Small Contact Windows Through the Oxide by Photolithography: A New Reason for an Old Window 1. Why This Window Serves a Completely Different Purpose Than Every Earlier One…

Planar Process 1959 Pattern Metal Interconnect Photolithography

hoerni 1959 metal etch undercut gap base emitter short, planar transistor 1959 second mask aluminum interconnect lines, silicon planar 1959 metal patterned not semiconductor

Pattern the Metal Into Interconnect Lines by a Second Photolithographic Mask: The Same Undercut, a New Way to Fail 1. Why the Gap Between Two Contacts Now Carries the Risk…

Planar 1959 Step 13 Mask Aligner Registration Tolerance

contact mask aligner equipment for 1959 photolithography, alignment tolerance between contact window and metal mask

Align the Second Mask to the First by Hand Under a Microscope: The Equipment Behind Step 3 and Step 6's Two Photographic Steps 1. Why Two Photolithographic Masks Only Work…

Planar 1959 Step 16 Hoerni Patent Filing Fairchild

jean hoerni planar process patent application 1959, fairchild semiconductor planar process patent claim scope

File the Patent on the Step This Series Refused to Take: Hoerni's Claim, Not Just His Idea 1. Why the Insight at Step 1 and Step 2 Needed a Name and a Filing Date, Not Just…

Planar Process

planar process transistor, oxide masking photolithography diffusion, hoerni planar process, junction termination under oxide

The Planar Process: Oxide Masking, Lateral Patterning & Why the Junction Finally Went Under Glass Every process this lineage has covered so far — point-contact whiskers, alloy…

Plasma

plasma process, semiconductor plasma, plasma processes

A semiconductor plasma is a weakly ionized gas where fewer than 1 in 300 particles carry charge — yet those few charged particles control 40–50% of all processing steps in…

Plasma-Activated Bonding

advanced packaging

Plasma-Activated Bonding (PAB) is a surface treatment technique that uses plasma exposure to dramatically enhance direct wafer bonding strength — breaking surface bonds…

Plasma Chamber Seasoning and First-Wafer Effect Mitigation with Machine Learning

plasma chamber seasoning and first wafer effect mitigation with machine learning, plasma chamber seasoning first wafer effect mitigation machine learning, se

Plasma Chamber Seasoning and First-Wafer Effect Mitigation with Machine Learning Introduction & Motivation Plasma Chamber Seasoning and First-Wafer Effect Mitigation with Machine…

ICP CCP Plasma Etch

icp ccp, plasma etch icp ccp, icp plasma etching, ccp plasma etching, inductively coupled plasma, capacitively coupled plasma, plasma density, electron density plasma, ne plasma etch, plasma density etch, icp plasma density

Plasma etching and reactor physics govern the dry, anisotropic material removal processes essential for patterning nanoscale semiconductor features. Driven by radio-frequency…

Plasma Dicing

reactive ion etch singulation, dry wafer dicing, etch profile control, sidewall damage, thin wafer singulation, narrow street width, particle generation reduction, advanced packaging dicing, chipping free edge

Plasma dicing is a dry wafer singulation method that separates individual die by reactive-ion etching through the scribe streets between them, rather than mechanically sawing…

Plasma Enhanced CVD

PECVD, plasma enhanced chemical vapor deposition, PECVD silicon nitride, low temperature CVD

Plasma-enhanced chemical vapor deposition. uses an RF or microwave plasma to dissociate precursor gases and create reactive radicals, enabling film formation at lower substrate…