127 technical terms and definitions
icp ccp, plasma etch icp ccp, icp plasma etching, ccp plasma etching, inductively coupled plasma, capacitively coupled plasma, wafer bias, bias power, rf bias etch, bias voltage plasma, etch bias control, ion energy etch, ccp bias
Plasma etching and reactor physics govern the dry, anisotropic material removal processes essential for patterning nanoscale semiconductor features. Driven by radio-frequency…
icp ccp, plasma etch icp ccp, icp plasma etching, ccp plasma etching, inductively coupled plasma, capacitively coupled plasma, endpoint detection, etch endpoint, optical emission spectroscopy, OES, interferometry, endpoint monitoring
Plasma etching and reactor physics govern the dry, anisotropic material removal processes essential for patterning nanoscale semiconductor features. Driven by radio-frequency…
icp ccp, plasma etch icp ccp, icp plasma etching, ccp plasma etching, inductively coupled plasma, capacitively coupled plasma, etch rate, etching rate, etch speed, material removal rate, plasma etch rate, etch rate plasma etching
Plasma etching and reactor physics govern the dry, anisotropic material removal processes essential for patterning nanoscale semiconductor features. Driven by radio-frequency…
halo implant, pocket implant, dopant, channeling, annealing, amorphization, junction depth, semiconductor doping, beamline implanter, doping
Ion implantation, atomic doping profile engineering, and advanced millisecond thermal annealing constitute the fundamental semiconductor manufacturing disciplines required…
metrology
I-V curve (current-voltage characteristic) maps the relationship between applied voltage and resulting current — the fundamental electrical fingerprint of semiconductor devices…
semiconductor, silicon, heterostructure
Wide bandgap (WBG) power semiconductors, gallium nitride (GaN) High-Electron-Mobility Transistors (HEMT), and silicon carbide (4H-SiC) power MOSFETs constitute the foundational…
compound semiconductor transistor, ingaas transistor, iii-v cmos, high mobility channel
III-V MOSFETs are transistors that use compound semiconductors from groups III and V of the periodic table (InGaAs, InP, GaAs) as the channel material — offering 5-10x higher…
indium phosphide, gallium arsenide, inp, gaas, compound semiconductor
III-V Compound Semiconductors (GaAs, InP, InGaAs, GaN) are the semiconductor materials formed by combining elements from groups III and V of the periodic table — offering superior…
inter-layer dielectric, oxide deposition, dielectric stack, beol dielectric
Inter-Layer Dielectric (ILD) Deposition is the process of depositing insulating films between metal interconnect layers — providing electrical isolation, mechanical planarization…
ilt, lithography, inverse lithography, curvilinear mask
Computational Lithography and Optical Proximity Correction constitute the mathematical and algorithmic backbone of sub-wavelength semiconductor patterning. Operating deep within…
ibo, metrology, box-in-box target, bar-in-bar AIM mark, tool-induced shift, TIS correction, multi-wavelength measurement, scribe-line target, overlay reference standard
Image-based overlay (IBO) measures layer-to-layer registration the way the name suggests — directly imaging a mark, usually a box-in-box or bar-in-bar target, through…
cmos image sensor fabrication, backside illumination bsi, pixel architecture sensor, stacked image sensor
CMOS Image Sensor (CIS) Process Technology is the specialized semiconductor manufacturing flow that creates arrays of millions of photodiodes integrated with per-pixel amplifiers…
193i lithography, arf immersion, arf immersion scanner, 193 nm immersion, multi-patterning lithography
Immersion (193i) lithography extends 193 nm ArF deep-ultraviolet lithography by filling the gap between the final projection lens and the wafer with ultra-pure water. Because…
water immersion scanner, hyper-na lithography, multipatterning process, argon fluoride immersion
Immersion Lithography 193nm Process — 193nm immersion lithography extends the resolution of argon fluoride excimer laser scanners by introducing a high-refractive-index water film…
immersion lithography bubble defect prediction, immersion lithography bubble, lithography bubble defect, bubble defect prediction, immersion lithography, bubble defect
Immersion Lithography Bubble Defect Prediction with Machine Learning Introduction & Motivation Immersion Lithography Bubble Defect Prediction with Machine Learning addresses…
modeling resist dissolution in immersion lithography, modeling resist dissolution, resist dissolution immersion, dissolution immersion lithography, modeling resist
Modeling resist dissolution in immersion lithography Introduction & Motivation Modeling resist dissolution in immersion lithography addresses a central problem in Lithography /…
immersion lithography fluid particle defect prediction machine learning, immersion lithography, fluid particle defect, immersion lithography fluid, fluid particle
Immersion Lithography Fluid Particle Defect Prediction with Machine Learning Introduction & Motivation Immersion Lithography Fluid Particle Defect Prediction with Machine Learning…
immersion lithography resist outgassing prediction, immersion lithography resist, lithography resist outgassing, resist outgassing prediction, immersion lithography
Immersion Lithography Resist Outgassing Prediction with Machine Learning Introduction & Motivation Immersion Lithography Resist Outgassing Prediction with Machine Learning…
193nm immersion, immersion fluid, pellicle immersion, water lens lithography
Immersion Lithography is the resolution-enhancing technique that places a thin layer of ultra-pure water between the projection lens and the wafer — increasing the numerical…
193nm immersion, immersion fluid, pellicle immersion, water lens immersion, immersion arfi
ArF Immersion Lithography (ArFi) is the optical lithography technique that achieves sub-100nm resolution by filling the gap between the final projection lens and the wafer…
immersion lithography water quality impact prediction, immersion lithography water, lithography water quality, water quality impact, quality impact prediction, lithography water
Immersion Lithography Water Quality Impact Prediction with Machine Learning Introduction & Motivation Immersion Lithography Water Quality Impact Prediction with Machine Learning…
implant wafer charging damage prediction, implant wafer charging, wafer charging damage, charging damage prediction, implant wafer, wafer charging, charging damage
Implant Wafer Charging Damage Prediction with Machine Learning Introduction & Motivation Implant Wafer Charging Damage Prediction with Machine Learning addresses a central problem…
implanter end station wafer handling prediction machine learning, implanter end, station wafer handling, implanter end station wafer handling prediction, end station
Implanter End Station Wafer Handling Prediction with Machine Learning Introduction & Motivation Implanter End Station Wafer Handling Prediction with Machine Learning addresses…
metrology
In-line metrology encompasses all measurements performed during wafer processing to monitor, control, and optimize the manufacturing process in real-time. Philosophy: Measure…
hf vapor clean, hydrogen plasma clean, pre deposition clean, surface preparation
In-Situ Cleaning for Surface Preparation is the suite of gas-phase and plasma-based cleaning techniques performed inside the deposition or etch chamber (or cluster tool)…
in situ ellipsometry, real-time spectroscopic ellipsometry, real time ellipsometry, in-situ process monitoring, ellipsometry endpoint detection, in-situ thin film metrology
In-situ ellipsometry watches a surface while deposition, etching, annealing, adsorption, oxidation, or another process is still occurring. That timing changes the measurement…
in situ tem, in-situ transmission electron microscopy, operando tem, tem heating biasing, in-situ tem semiconductor
In semiconductor process development, a cross-sectional TEM image can show where an interface ended up, but it cannot by itself reveal which event created that interface. In-situ…
incoming bare wafer substrate defect inspection prediction machine learning, incoming bare, wafer substrate defect, incoming bare wafer, bare wafer substrate
Incoming Bare Wafer Substrate Defect Inspection Prediction with Machine Learning Introduction & Motivation Incoming Bare Wafer Substrate Defect Inspection Prediction with Machine…
incoming wafer material qualification prediction, incoming wafer material, wafer material qualification, material qualification prediction, incoming wafer
Incoming Wafer Material Qualification Prediction with Machine Learning Introduction & Motivation Incoming Wafer Material Qualification Prediction with Machine Learning addresses…
packaging
Incomplete filling is the molding defect where encapsulant does not fully occupy all intended cavity regions around the package - it can create exposed structures, weak protection…
indium phosphide epiwafer defect prediction, indium phosphide epiwafer, phosphide epiwafer defect, epiwafer defect prediction, indium phosphide, phosphide epiwafer, epiwafer defect
Indium Phosphide Epiwafer Defect Prediction with Machine Learning Introduction & Motivation Indium Phosphide Epiwafer Defect Prediction with Machine Learning addresses a central…
semiconductor industry carbon neutrality goal, semiconductor industry carbon, industry carbon neutrality, carbon neutrality goal, semiconductor industry, industry carbon, neutrality goal
Semiconductor Industry Carbon Neutrality Goal Introduction & Motivation Semiconductor Industry Carbon Neutrality Goal addresses a central problem in sustainability process control…
semiconductor industry carbon neutrality goals, semiconductor industry carbon, industry carbon neutrality, carbon neutrality goals, semiconductor industry, industry carbon, carbon neutrality
Semiconductor Industry Carbon Neutrality Goals Introduction & Motivation Semiconductor Industry Carbon Neutrality Goals addresses a central problem in sustainability process…
edge inference chip, neural engine int4, hardware sparsity support, always on ai chip, mcm edge ai chip
An inference chip is an accelerator optimized to run a trained neural network with low latency, high throughput, or low energy per request rather than to compute training…
info, integrated fan-out, advanced packaging
Integrated Fan-Out is TSMC's fan-out wafer-level packaging technology that redistributes die I/O to a larger area without a traditional package substrate. First used in Apple's…
lithography
Infrared alignment is the alignment technique that uses infrared transmission through silicon to view frontside marks from the backside during lithography registration - it is…
IR ellipsometry, infrared spectroscopic ellipsometry, IR-VASE, FTIR ellipsometry, far-infrared ellipsometry, infrared dielectric function metrology
Infrared ellipsometry extends polarization-resolved optical metrology into energies where lattice vibrations, molecular bonds, free carriers, and low-energy excitations dominate…
semiconductor infrastructure, datacenter infrastructure, power delivery, pue, cooling, liquid cooling, fab facility, ultrapure water, rack power, thermal resistance, vrm, co-packaged optics, grid interconnection
Infrastructure is everything a chip depends on that is not the chip: the power chain that delivers current to it, the thermal chain that carries heat away, the water and air that…
packaging, thermoplastic encapsulation, gate placement, cooling channel design, warpage, sink marks, mold tooling cost, SPC process control, package housing
Injection molding forms shaped electronics components by plasticizing a thermoplastic material and injecting it at high pressure into a mold cavity, where it cools and solidifies…
metrology
Spectroscopic ellipsometry and inline optical wafer metrology constitute the non-destructive physical measurement and defect detection disciplines that govern yield control across…
wafer inspection control, defect classification review, yield learning methodology, automated defect detection
In-Line Defect Monitoring and Control — In-line defect monitoring systematically inspects wafers at critical process steps throughout the CMOS fabrication flow to detect…
inline process control, inline cd measurement, inline overlay, inline thickness measurement, process control semiconductor
Spectroscopic ellipsometry and inline optical wafer metrology constitute the non-destructive physical measurement and defect detection disciplines that govern yield control across…
yield enhancement
Spectroscopic ellipsometry and inline optical wafer metrology constitute the non-destructive physical measurement and defect detection disciplines that govern yield control across…
nanosheet finfet, inner spacer formation, inner spacer dielectric deposition, selective etch inner spacer, inner spacer capacitance, gaa, nanosheet
Gate-All-Around (GAA) nanosheet field-effect transistors, Multi-Bridge Channel FETs (MBCFET), and vertically stacked ribbon architectures constitute the advanced three-dimensional…
inner spacer gaa, spacer dielectric deposition, inner spacer etch selectivity, spacer parasitic capacitance
Gate-All-Around (GAA) nanosheet field-effect transistors, Multi-Bridge Channel FETs (MBCFET), and vertically stacked ribbon architectures constitute the advanced three-dimensional…
compound semiconductor hbt, inp mosfet high frequency, indium phosphide semiconductor, iii-v compound semiconductor
An InP/InGaAs heterostructure deliberately places material discontinuities to control carriers. In an InAlAs/InGaAs HEMT, barrier-supplied electrons accumulate in a lower-energy…
inp photonic wafer test yield prediction machine learning, inp photonic, wafer test yield, inp photonic wafer test yield prediction, inp photonic wafer, photonic wafer test
InP Photonic Wafer Test Yield Prediction with Machine Learning Introduction & Motivation InP Photonic Wafer Test Yield Prediction with Machine Learning addresses a central problem…
Metrology and inspection are the two measurement disciplines that keep a semiconductor fab in control — they are how a foundry knows, wafer by wafer, whether hundreds of process…
equipment installation qualification, semiconductor equipment qualification, tool installation qualification, installation qualification protocol
Installation qualification (IQ) is the documented demonstration that semiconductor manufacturing equipment, its facilities hookups, safety provisions, software baseline…
idpc, idpc-stem, integrated dpc, integrated differential phase contrast stem, light element stem imaging, idpc semiconductor interface
High-angle annular dark-field STEM makes heavy atomic columns easy to recognize because strong high-angle scattering creates intuitive bright contrast, but that same weighting can…