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Glossary

3,533 technical terms and definitions

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Wafer Bonding

Wafer bonding is a process that joins two separately processed wafers face to face into a single mechanically and often electrically connected structure, enabling…

Wafer Dicing

Wafer dicing is the process of physically cutting a finished, fully tested wafer apart into its individual chips, separating the many identical dies that were manufactured…

What Is Wafer Test

wafer probe test explained, dicing singulation semiconductor, chip packaging types, CoWoS advanced packaging, HBM TSV stacking, known good die

Once the last metal layer is done, a finished wafer is still just a fragile glass-thin disc holding hundreds of identical, untested chips. Everything up to this point…

Wafer Thinning

Wafer thinning is a process that mechanically and chemically reduces a finished wafer's thickness, often down to a fraction of its original size, to enable thin chip packaging, 3D…

What Is Wire Bonding

wire bonding explained, wire bonding vs flip chip, chip wire bonding meaning, what does wire bonding mean

Wire bonding is the traditional method of connecting a silicon die to its package by attaching extremely thin metal wires between connection pads on the die's edges…

What Is Chip Yield

semiconductor yield explained, wafer yield meaning, why yield matters, chip manufacturing yield

Yield is the percentage of chips on a wafer that come out good enough to sell, and it is the single number that decides more about a chip's real-world cost than almost anything…

White Light Interferometer

metrology

White light interferometer (WLI) is an optical surface profiling instrument that uses broadband (white) light interference to measure 3D surface topography with sub-nanometer…

White Light Interferometry

coherence scanning interferometry, csi, wli, phase shifting interferometry, optical surface profiler, mirau interferometer, 3d optical profilometry, metrology

White light interferometry is an optical surface profiling technique that uses broadband, low-coherence light to measure 3D surface topography, step heights, and areal surface…

Whole-Chip ESD Protection

design, esd protection network, power clamp, esd

Electrostatic Discharge (ESD) protection constitutes the dedicated on-chip network of high-current shunting devices engineered to safeguard sensitive gate dielectrics, thin tunnel…

Why 300mm Wafers

300mm vs 200mm wafer, why are wafers 300mm, wafer size explained, why did wafers get bigger, 450mm wafer, dies per wafer

Modern fabs process silicon in the shape of 300-millimeter round wafers, not because that size is fundamentally special, but because it is the point where a bigger circle stopped…

Why Do Chips Need Cooling

why does a cpu need a heat sink, chip cooling explained, why do processors get hot, chip overheating

A chip needs cooling because every single transistor switching on and off wastes a small amount of energy as heat, and a modern processor switches billions of transistors billions…

Why Silicon

why is silicon used for chips, why do chips use silicon, why is silicon used in semiconductors, silicon semiconductor material, why not another material for chips

Chips are made from silicon because silicon sits in a narrow, useful middle ground: pure silicon barely conducts electricity on its own, but adding tiny, precisely controlled…

Wide

bandgap, semiconductor, SiC, power, devices

Wide bandgap (WBG) power semiconductors, gallium nitride (GaN) High-Electron-Mobility Transistors (HEMT), and silicon carbide (4H-SiC) power MOSFETs constitute the foundational…